Resin modifiers/curing agents
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SHIKOKU CHEMICALS Co, has developed a unique group of compounds that can be added to resins to improve various properties.
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These resin modifiers are used in a wide range of applications such as "CFRP", "Semiconductors", "OLED and other displays", "High performance adhesives", etc.
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Adhesion Improvement
Additive-type adhesion promoters that achieve improved adhesion to various metals
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Low Dk/Df
PPE resin and BMI resin cross-linker that combines excellent electrical properties with heat resistance, adhesion, and flame retardance
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Heat Resistance
ImprovementOur resin cross-linking agents, thiol resin curing agents, and high heat-resistant resins that can achieve improved heat resistance
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Curability Improvement
Epoxy resin curing agents and effect accelerators that meet various needs such as short curing time and long pot life
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Flame Retardance
ImprovementLow-dielectric, flame-retardant resin cross-linker that can combine flame-retardant and electrical properties
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High Refractive Index
New reactive high refractive index material that satisfies high refractive index, low viscosity, and high solubility
