Imidazole Type Curing Agent for Epoxy Resin CUREZOL®︎
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CUREZOL®︎ is mainly used as an epoxy resin hardener for electronic and electric application.
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It is also used as an accelerator for epoxy resin hardener combined with phenolic resin. acid anhydride or dicyandiamide, and indicates good characteristics for electronic and electronic application.
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It has various grade, and we can recommend the most suitable one for your requirement such as curingspeed and pot life.
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Mechanism of epoxy curing with Imidazole
Reactivity of CUREZOL®
We have a wide range of Products with different activities.
Applications
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Printed Circuit Boards
Peripheral Materials -
CFRP
Adhesives for Automotive Structure -
Encapsulants, laminates,
inks, electronic components, etc.
Adduct Type Latent Curing Agent for Epoxy Resin CUREDUCT™
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A latent curing agent based on imidazole derivatives.
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By combining P and L components, it is possible to formulate a highly storage-stable roasting solution.
Storage stability
Low viscosity increase even under high temperature and long-term strange.
Applications
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Printed Circuit Boards
Peripheral Materials -
CFRP
Adhesives for Automotive Structure -
Encapsulants, laminates,
inks, electronic components, etc.
Cationic Fast Curing Monomer HiREM-1
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Cationic curable epoxy monomer that can be cured by light or heat.
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It has high curability and can be cured at low temperatures and quickly.
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Cured products with high heat resistance and high mechanical strength can be obtained.
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Thermosetting (105°C gel time)
Curing Temperature: 105℃
Comparison of cured material heat resistance (Tg/TMA)
Curing Temperature: 105℃
Application
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Low temperature curing adhesives
Adhesive sheet -
Display Materials
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Various film materials
