Resin modifiers/curing agents
Curability Improvement
Epoxy resin curing agents and effect accelerators that meet various needs such as short curing time and long pot life.

Imidazole Type Curing Agent for Epoxy Resin CUREZOL®︎

  • CUREZOL®︎ is mainly used as an epoxy resin hardener for electronic and electric application.

  • It is also used as an accelerator for epoxy resin hardener combined with phenolic resin. acid anhydride or dicyandiamide, and indicates good characteristics for electronic and electronic application.

  • It has various grade, and we can recommend the most suitable one for your requirement such as curingspeed and pot life.

  • OR Series
    OR Series
  • CN Series
    CN Series
  • Azine Series
    Azine Series
  • OK Series
    OK Series
  • HZ Series
    HZ Series
  • ZL Series
    ZL Series

Mechanism of epoxy curing with Imidazole

Mechanism of epoxy curing with Imidazole.

Reactivity of CUREZOL®

We have a wide range of Products with different activities.

Reactivity of CUREZOL®

Applications

  • Printed Circuit Boards/Peripheral Materials

    Printed Circuit Boards
    Peripheral Materials

  • CFRP/Adhesives for Automotive Structure

    CFRP
    Adhesives for Automotive Structure

  • Encapsulants, laminates,inks, electronic components, etc.

    Encapsulants, laminates,
    inks, electronic components, etc.

Adduct Type Latent Curing Agent for Epoxy Resin CUREDUCT™

  • A latent curing agent based on imidazole derivatives.

  • By combining P and L components, it is possible to formulate a highly storage-stable roasting solution.

Storage stability

Low viscosity increase even under high temperature and long-term strange.

Storage stability
Formulation: Bisphenol A Epoxy Resin/P-0505/L-07N = 100/2/10

Applications

  • Printed Circuit Boards/Peripheral Materials

    Printed Circuit Boards
    Peripheral Materials

  • CFRP/Adhesives for Automotive Structure

    CFRP
    Adhesives for Automotive Structure

  • Encapsulants, laminates,inks, electronic components, etc.

    Encapsulants, laminates,
    inks, electronic components, etc.

Cationic Fast Curing Monomer HiREM-1

  • Cationic curable epoxy monomer that can be cured by light or heat.

  • It has high curability and can be cured at low temperatures and quickly.

  • Cured products with high heat resistance and high mechanical strength can be obtained.

Thermosetting (105°C gel time)

Thermosetting (105°C gel time)
Formulation: Epoxy monomer (100) / SI-100L (0.2)
Curing Temperature: 105℃

Comparison of cured material heat resistance (Tg/TMA)

Comparison of cured material heat resistance (Tg/TMA)
Formulation: Epoxy monomer (100) / SI-100L (0.2)
Curing Temperature: 105℃

Application

  • Low temperature curing adhesives/Adhesive sheet

    Low temperature curing adhesives
    Adhesive sheet

  • Display Materials

    Display Materials

  • Various film materials

    Various film materials

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