Resin modifiers/curing agents

Heat Resistance Improvement

Shikoku Chemical's resin cross-linking agents, thiol resin curing agents, and high heat-resistant resins that can achieve improved heat resistance.

High Heat-resistant Resin Benzoxazine P-d, F-a, ALP-d

Benzoxazine is a thermosetting resin with high heat resistance (Tg 100°C or higher).
It is characterized by high dimensional stability,high flame retardance,low dielectric loss tangent,high dustiness, andlow water absorption.
Copolymerization with epoxy resins, phenolic resins, etc. is possible.Particularly effective as a cross-linking agent for bismaleimide resins.
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Benzoxazine curing reaction

The benzoxazine ring is opened by heat, and the polymerization reaction proceeds.

It has high curability against epoxy resins and can be cured at low temperatures and quickly.
Epoxy cured materials with high moisture resistance,high heat resistance,high mechanical strength, etc. can be obtained.
C3TS-G is a liquid, low-viscosity compound at room temperature and has excellent handling properties.

Cured products with BisA epoxy have a Tg of 100°C or higher.

No decrease in adhesive strength is observed even after a moisture resistance (PCT) test.

It can be used for UV curing resin raw materials, insulating varnishes, and PVC stabilizers.
It gives excellent properties such as heat resistance, plasticity, adhesion, hardness, and gloss.

Liquid THEIC is available in two grades, THEIC-LD and THEIC-EP.
It can be used as a raw material for polyurethane and polyester, it can provide heat resistance, flame retardance, and weather resistance.
Liquefaction of THEIC is expected to improve workability and expand the range of application.

Product name	THEIC-LD	THEIC-EP
appearance	Light yellow transparent viscous liquid	Yellowish brown transparent viscous liquid
average molecular weight	561～673	435～494
Hydroxyl value (mgKOH/g)	250～300	330～380
Acid value (mgKOH/g)	＜10	＜10
Viscosity (Pa-s)	14.5(25℃)	65.0(25℃)