Surface treatment chemicals for PWBs
“Glicoat" protects copper circuits on PWBs from oxidation (rust) and ensures good solderability. “Glicoat” has the world's top share of the OSP (Organic Solderability Preservative) market.
Together with “Glibrite”, a roughening agent that roughens the copper surface to physically enhance adhesion with resin, and “GliCAP”, a next-generation adhesion enhancement process that does not roughen the copper surface but chemically enhances adhesion with resin using an organic film, we are playing a role in the improving density and performance of IT equipment.
OSP is a heat-resistant water-soluble rust inhibitor that forms an organic film on the copper surface of PWBs to protect them from oxidation (rust). OSP ensures good solderability even under lead-free soldering conditions.
Glibrite is a copper surface treatment agent for PWBs.
Glibrite enables optimal pretreatment and roughening of copper surfaces in OSP and other processes.
Glibrite is an ideal agent for improving the adhesion of dry film and solder resist.
GliCAP selectively forms organic films on the copper surface of PWBs to improve adhesion to resin. Since it is non-roughened, it has excellent electrical transmission characteristics in the high-frequency range and can be used for miniaturization of copper circuits.