Microetching solution
"Glibrite" GB series
GB series are developed by our organic synthesis technology.
GB series achieve the optimum copper surface roughness for various applications.
![Glibrite GB series](https://kagaku.shikoku.co.jp/wp/wp-content/themes/shikoku/assets/img/products/pwb/sokayakuzai/en/img-sokayakuzai_01.jpg)
Microetching solution
Glibrite GB‒1000F/GB‒1400
GB-1000F/GB-1400 are H2O2/H2SO4 system microetching solution. Good compatibility for pretreatment of OSP, HASL and metalic plating.
Especially GB-1000F/GB-1400 are good compatibility with OSP and achieve high performance.
In addition, GB-1400 prevents over-etching trouble caused by galvanic effect leads to reliable PWBs.
Advantages
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Good compatibility with Glicoat series OSP and excellent solderability
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Excellent anti chlorine resistance, possible using city water (GB-1400)
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Preventing over-etching trouble caused by galvanic effect leads to reliable PWBs (GB-1400)
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Possible to provide additive chemical only
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Solderability
![Solderability](https://kagaku.shikoku.co.jp/wp/wp-content/themes/shikoku/assets/img/products/pwb/sokayakuzai/en/soka_tab1_01.png)
Etching amount:2.0μm
Glicoat-SMD F2 OSP thickness:0.20μm
Test coupon FR-4, t=1.2mm, Ø=0.60mm, 261 holes
Microetching chemical for OSP
Glibrite GB-200
Suitable microetching chemical for OSP because of stable etching speed and uniform copper surface topology even high copper ion concentration.
Advantages
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Uniform and smooth copper surface topology even low etching amount.
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Stable etching rate even chlorine contamination.
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Stable etching speed makes easy maintenance and dissoves easily.
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![Chlorine resistance](https://kagaku.shikoku.co.jp/wp/wp-content/themes/shikoku/assets/img/products/pwb/sokayakuzai/en/soka_tab200_01_en.png)
![Copper concentration](https://kagaku.shikoku.co.jp/wp/wp-content/themes/shikoku/assets/img/products/pwb/sokayakuzai/en/soka_tab200_02_en.png)
Copper surface topography
![Copper surface topography](https://kagaku.shikoku.co.jp/wp/wp-content/themes/shikoku/assets/img/products/pwb/sokayakuzai/en/soka_tab200_04.png)
Pretreatment for Dry film
Glibrite GB‒3100
Glibrite GB-3100 is copper surface roughening solution for dry film pretreatment of patterning dry film and form uniform and fine roughening morphology even with low etching amount.
Advantages
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Excellent adhesion between copper and dry film with low etching amount
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Low defect rate of AOI due to brighter copper appearance
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Much lower running cost by using additive type
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![Advantages](https://kagaku.shikoku.co.jp/wp/wp-content/themes/shikoku/assets/img/products/pwb/sokayakuzai/en/soka_tab2_01.png)
Solder resist Pretreatment for PWB and IC substrate
Glibrite GB‒4300
Glibrite GB-4300 is an additive for copper roughening solution based on H2O2/H2SO4 system, which is designed for solder resist or inner-layer resin preparation, in order to give the best adhesion with lower etching amount.
Advantages
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Excellent solder resist adhesion with much less etching amount than conventional products
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Suitable for super fine copper circuit and higher frequency requirement, because of lower roughness
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Good stability in high copper concentration achieves low running cost
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Property
![Property](https://kagaku.shikoku.co.jp/wp/wp-content/themes/shikoku/assets/img/products/pwb/sokayakuzai/img-sokayakuzai_07.jpg)
Appearance
![Appearance](https://kagaku.shikoku.co.jp/wp/wp-content/themes/shikoku/assets/img/products/pwb/sokayakuzai/en/soka_tab3_01.png)
Copper roughness(Rz)
![Copper roughness(Rz)](https://kagaku.shikoku.co.jp/wp/wp-content/themes/shikoku/assets/img/products/pwb/sokayakuzai/en/soka_tab3_02.png)
Solder resist adhesion after Gold planting
![Solder resist adhesion after Gold planting](https://kagaku.shikoku.co.jp/wp/wp-content/themes/shikoku/assets/img/products/pwb/sokayakuzai/en/soka_tab3_03.png)