Surface treatment chemicals for PWBs

Microetching solution
"Glibrite" GB series

GB series are developed by our organic synthesis technology.
GB series achieve the optimum copper surface roughness for various applications.

Glibrite GB series

Microetching solution
Glibrite GB‒1000F/GB‒1400

GB-1000F/GB-1400 are H2O2/H2SO4 system microetching solution. Good compatibility for pretreatment of OSP, HASL and metalic plating.
Especially GB-1000F/GB-1400 are good compatibility with OSP and achieve high performance.
In addition, GB-1400 prevents over-etching trouble caused by galvanic effect leads to reliable PWBs.

Advantages

    • Good compatibility with Glicoat series OSP and excellent solderability

    • Excellent anti chlorine resistance, possible using city water (GB-1400)

    • Preventing over-etching trouble caused by galvanic effect leads to reliable PWBs (GB-1400)

    • Possible to provide additive chemical only

Solderability

Solderability

Etching amount:2.0μm
Glicoat-SMD F2 OSP thickness:0.20μm
Test coupon FR-4, t=1.2mm, Ø=0.60mm, 261 holes

Microetching chemical for OSP
Glibrite GB-200

Suitable microetching chemical for OSP because of stable etching speed and uniform copper surface topology even high copper ion concentration.

Advantages

    • Uniform and smooth copper surface topology even low etching amount.

    • Stable etching rate even chlorine contamination.

    • Stable etching speed makes easy maintenance and dissoves easily.

Chlorine resistance
Copper concentration

Copper surface topography

Copper surface topography

Pretreatment for Dry film
Glibrite GB‒3100

Glibrite GB-3100 is copper surface roughening solution for dry film pretreatment of patterning dry film and form uniform and fine roughening morphology even with low etching amount.

Advantages

    • Excellent adhesion between copper and dry film with low etching amount

    • Low defect rate of AOI due to brighter copper appearance

    • Much lower running cost by using additive type

Advantages

Solder resist Pretreatment for PWB and IC substrate
Glibrite GB‒4300

Glibrite GB-4300 is an additive for copper roughening solution based on H2O2/H2SO4 system, which is designed for solder resist or inner-layer resin preparation, in order to give the best adhesion with lower etching amount.

Advantages

    • Excellent solder resist adhesion with much less etching amount than conventional products

    • Suitable for super fine copper circuit and higher frequency requirement, because of lower roughness

    • Good stability in high copper concentration achieves low running cost

Property

Property

Appearance

Appearance

Copper roughness(Rz)

Copper roughness(Rz)

Solder resist adhesion after Gold planting

Solder resist adhesion after Gold planting
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