High Heat-resistant Resin Benzoxazine P-d, F-a, ALP-d
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Benzoxazine is a thermosetting resin with high heat resistance (Tg 100°C or higher).
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It is characterized by high dimensional stability,high flame retardance,low dielectric loss tangent,high dustiness, andlow water absorption.
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Copolymerization with epoxy resins, phenolic resins, etc. is possible.Particularly effective as a cross-linking agent for bismaleimide resins.
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Benzoxazine curing reaction
The benzoxazine ring is opened by heat, and the polymerization reaction proceeds.
Application
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Various electronic substrate materials
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For Power Module Encapsulating Materials
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Resins for CFRP
Multifunctional Thiol Epoxy Resin Curing and Cross-linking Agents TS-G,C3TS-G
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It has high curability against epoxy resins and can be cured at low temperatures and quickly.
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Epoxy cured materials with high moisture resistance,high heat resistance,high mechanical strength, etc. can be obtained.
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C3TS-G is a liquid, low-viscosity compound at room temperature and has excellent handling properties.
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Comparison of cured material heat resistance (Tg/DMA)
Cured products with BisA epoxy have a Tg of 100°C or higher.
* N,N-Dimethylbenzylamine
Comparison of moisture resistance (adhesive strength around 120°C/100%RT/48hrs)
No decrease in adhesive strength is observed even after a moisture resistance (PCT) test.
* N,N-Dimethylbenzylamine
Application
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Low temperature curing adhesives Adhesive sheet
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Display Materials
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Various film materials
THEIC
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It can be used for UV curing resin raw materials, insulating varnishes, and PVC stabilizers.
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It gives excellent properties such as heat resistance, plasticity, adhesion, hardness, and gloss.
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White crystaline granula or power
characteristics
| Product name | THEIC-G | THEIC-PW | |
|---|---|---|---|
| appearance | White crystalline granules | White crystalline powder | |
| molecular weight | 261.22 | ||
| hydroxyl value | 645 | ||
| Solubility (g/100g at 25°C) | ethanol | 5.7 | |
| acetone | 1.9 | ||
| water | 119.0 | ||
Heat-resistant Multifunctional polyol Liquid THEIC
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Liquid THEIC is available in two grades, THEIC-LD and THEIC-EP.
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It can be used as a raw material for polyurethane and polyester, it can provide heat resistance, flame retardance, and weather resistance.
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Liquefaction of THEIC is expected to improve workability and expand the range of application.
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characteristics
| Product name | THEIC-LD | THEIC-EP |
|---|---|---|
| appearance | Light yellow transparent viscous liquid | Yellowish brown transparent viscous liquid |
| average molecular weight | 561～673 | 435～494 |
| Hydroxyl value (mgKOH/g) | 250～300 | 330～380 |
| Acid value (mgKOH/g) | ＜10 | ＜10 |
| Viscosity (Pa-s) | 14.5(25℃) | 65.0(25℃) |
Application
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Urethane foam
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synthetic leather
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RIM into profiles
Polyfunctional carboxylic acid with triazine ring CIC acid
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It is possible to introduce triazine rings into resins by carboxyl group reactivity.
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Triazine ring improves heat resistance, weather resistance, hardness,transparency. Methylene chains provide flexibility.
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C3-CIC acid has a low melting point and good solubility in solvents.
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characteristics
| Product name | C1-CIC acid | CIC acid | C3-CIC acid | OH-CIC acid | |
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| Stage | Under development | Commercial | Commercial | under development | |
| Appearance | White crystalline powder | White crystalline powder | White crystalline powder | White crystalline powder | |
| Purity（%） | 95 min. | 98.5 min. | 95 min. | 90 min. | |
| Melting point（℃） | 258～261 | 223～226 | 114～117 | 136～139 | |
| TG 5% mass decrease temperature（℃） | 339 | 276 | 337 | 239 | |
| Solubility※ | Water | 57 | 2.7 | 150 | 20 |
| DMF | 91 | 100 | 115 | 124 | |
| Methanol | 65 | 3.2 | 136 | 30 | |
| Ethyl acetate | ＜ 0.1 | ＜ 0.1 | 0.9 | 0.8 | |
※ Solubility ： g／solvent100ml at 25℃
Application
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Raw material for polyester and polyamide resin
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Crosslinking agent for powder coating
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Solder paste activator
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