Surface treatment chemicals for PWBs
Chemical Adhesion Process
GliCAP
GliCAP is new interface chemical developed based on our organic synthesis technology. Unique organic coating formed on copper surface directly improves adhesion between copper and resin effectively.
Advantages
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Excellent adhesion with solder resist and inner layer without roughening copper surface
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Excellent signal transmission even in higher frequency application because of smooth copper surface
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The best treatment for super fine copper circuit pattern because of no microetching
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Simple process by direct treatment on copper
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Adhesion mechanism
Process
Cross section by FIB
Peel strength
Sample :Build up resin（Dry film type）
Process :Cu treatment → Laminating → Reflow 2 times → PCT → Peeling test
Reflow condition :Peak/260 deg.C
PCT condition :121deg.C/100％RH/100hr