GB-1000F/GB-1400 are H₂O₂/H₂SO₄ system microetching solution. Good compatibility for pretreatment of OSP, HASL and metalic plating.
Especially GB-1000F/GB-1400 are good compatibility with OSP and achieve high performance.
In addition, GB-1400 prevents over-etching trouble caused by galvanic effect leads to reliable PWBs.

Advantages

• • Good compatibility with Glicoat series OSP and excellent solderability

  • Excellent anti chlorine resistance, possible using city water (GB-1400)

  • Preventing over-etching trouble caused by galvanic effect leads to reliable PWBs (GB-1400)

  • Possible to provide additive chemical only

Solderability

Etching amount：2.0μm
Glicoat-SMD F2 OSP thickness：0.20μm
Test coupon FR-4, t=1.2mm, Ø=0.60mm, 261 holes

Suitable microetching chemical for OSP because of stable etching speed and uniform copper surface topology even high copper ion concentration.

Advantages

• • Uniform and smooth copper surface topology even low etching amount.

  • Stable etching rate even chlorine contamination.

  • Stable etching speed makes easy maintenance and dissoves easily.

Copper surface topography

Glibrite GB-3100 is copper surface roughening solution for dry film pretreatment of patterning dry film and form uniform and fine roughening morphology even with low etching amount.

Advantages

• • Excellent adhesion between copper and dry film with low etching amount

  • Low defect rate of AOI due to brighter copper appearance

  • Much lower running cost by using additive type

Glibrite GB-4300 is an additive for copper roughening solution based on H₂O₂/H₂SO₄ system, which is designed for solder resist or inner-layer resin preparation, in order to give the best adhesion with lower etching amount.

Advantages

• • Excellent solder resist adhesion with much less etching amount than conventional products

  • Suitable for super fine copper circuit and higher frequency requirement, because of lower roughness

  • Good stability in high copper concentration achieves low running cost

Property

Appearance

Copper roughness(Rz)

Solder resist adhesion after Gold planting