SEMICON Japan 2023 (Advanced Packaging and Chiplet Summit)
| Exhibit Products | 【Electronic Chemicals Sales Dept.】
・Organic Solderability Preservative “Glicoat-SMD F2(LX)PK-G” ・Chemical Adhesion Process “GliCAP™” 【Advanced & Specialty Chemicals Sales Dept.】 ・Low-dielectric, flame-retardant cross-linker “VP-1”（reference exhibition） |
| Booth NO | 3948 |