News
  • HOME
  • News
  • SEMICON Japan 2023 (Advanced Packaging and Chiplet Summit)

SEMICON Japan 2023 (Advanced Packaging and Chiplet Summit)

 

Exhibit Products 【Electronic Chemicals Sales Dept.】

・Organic Solderability Preservative “Glicoat-SMD F2(LX)PK-G”

・Chemical Adhesion Process “GliCAP™”

【Advanced & Specialty Chemicals Sales Dept.】

・Low-dielectric, flame-retardant cross-linker “VP-1”(reference exhibition)

Booth NO 3948

 

Events

Dates
Wed, Dec. 13, 2023 ~ Fri, Dec. 15, 2023
Venue
Tokyo Big Sight
Website
https://www.semiconjapan.org/en
This site is registered on wpml.org as a development site.