树脂改性剂/固化剂
低介电树脂交联剂 L-DAIC Low-dielectric Resin Cross-linker
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可用作聚苯醚树脂、双马来酰亚胺树脂的烯丙基交联剂。
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可实现低于传统交联剂的介电损耗角正切。
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具有低于传统烯丙基交联剂的挥发性,可抑制固化过程中的成分变化和设备污染。
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L-DAIC Colorless liquid - White Solid
介电损耗角正切比较
实现了低于传统烯丙基交联剂的介电损耗角正切
![介电损耗角正切比较](https://kagaku.shikoku.co.jp/wp/wp-content/themes/shikoku/assets/img/products/resin-additive/resin-additive-p3/p3_1_df.png)
Formulation(phr):PPE NORYL SA9000-111 (22.4) / Allyl Derivative (20.0) / Phase Solv. SBS resin (7.6) / Radical Initiator PERBUTYL P (1.2) Curing Condition:150 degree C/0.5h+190 degree C/1.0h Measurement Method:Cavity Resonance Method (10GHz)
挥发性比较
具有高于传统烯丙基交联剂的沸点,实现了低挥发性
![挥发性比较](https://kagaku.shikoku.co.jp/wp/wp-content/themes/shikoku/assets/img/products/resin-additive/resin-additive-p3/p3_1_tg.png)